Mechanical Program Lead Engineer

End-to-end ownership of complex sub-systems and system design for advanced semiconductor processing equipment, including process chambers, gas and liquid chemical delivery, frames, thermal, power and motion controls. System-level mechanical design, involving one or more of structural, thermal, flow and electro-mechanical domains of mechanical engineering. Responsible for project planning, scope assessment, concept development, technical risk mitigation through engineering analysis and calculations, DFMEA, DfX, detailed design with comprehensive test plans, design validation, documentation, and release. Collaborate with local and global cross-functional teams: electrical engineering, systems engineering, software, product support, process engineering, product and program management, and supplier engineering, on the design and fabrication of proprietary sub-systems, and the selection and modification of OEM components. Work with potential suppliers to ensure parts can be manufactured as per performance and cost objectives. Develop and present reports/presentations to communicate design intent, analysis, and validation in engineering design and program reviews. Lead troubleshooting, structured investigations, RCCAs, and implementation of solutions, for equipment safety, line down, reliability, and productivity issues. Review design work done by junior engineers and provide them with technical mentorship. Publish new or enhance existing design standards & BKMs. Proficiency in fluid transfer systems (pneumatics & hydraulics), System integration of electromechanical with controls and expertise in system level P&ID creation. Proficiency in OEM component selection (pumps, actuators, valves, Transducers, Pressure regulators, Sensors, Gauges etc.), performing hand calculations to ensure proper functionality, line sizing and safety. Proficiency in DoE (design of experiments), FMEA (failure modes & effects analysis), and DFX (design for cost, manufacturability, assembly, reliability, safety, testing, serviceability). Proficiency in structured problem-solving techniques (RCCA, 8D, 5Why, Fishbone). Strong manufacturing knowledge in Plastics and Metals Fabrication (conventional & non-conventional), welding, sheet metal fabrication and exposure to additive manufacturing. Exposure to structural, flow & thermal analysis using simulation software. Experience in developing System level/Sub system level requirement specifications. Experience in development of sub system level verification and validation plans and testing. Strong project management and communication skills. Semiconductor industry experience and familiarity with SEMI standards preferred. Experience in non-conventional Plastic manufacturing processes like Machining and Jointing & Additive Mfg.