VP, Advanced Packaging Technology

Provides leadership for external eco-system engagements that support next generation advanced packaging technology development. AP technology strategy & roadmap Establish and implement a comprehensive technology roadmap for advanced packaging solutions, aligning with market trends, customer requirements, and industry megatrends (e.g., AI, 3DIC, hybrid bonding, panel-level packaging) Product development & engineering Work closely with product teams to guide the development of advanced packaging solutions​ Ensure products meet performance, reliability, and cost targets, addressing customer needs and market competitiveness Customer engagement Engage with and understand customers' technology roadmaps and challenges, provide insightful perspectives that influence customers roadmaps, oversee co-development efforts Strategic partnership & ecosystem engagement Ownership for academic institutions, and industry consortia relationships and Lam sponsored programs​ Represent the company at industry events, conferences, and panels to promote technological leadership Leadership role in the Semiconductor industry, with a focus on advanced packaging technologies and FE/BE process integration Deep engagement with Tier-1 end customers (e.g., foundry, IDM, memory players), and proven success in fab/equipment company leadership, ideally within the packaging domain Expertise in hybrid bonding, with demonstrated impact from a fab operations, design enablement, or equipment innovation perspective Proven track record of leading the development and commercialization of advanced packaging solutions, from concept through HVM Extensive ecosystem influence, including active participation in industry consortia, strategic partnerships, and global customer engagements requiring significant travel Recognized as an industry thought leader, with a history of shaping technology roadmaps and presenting at major conferences