Own the modeling, validation, and application of market sizing and segmentation data in the HI BU, especially for Plating and Panel and other process units as needed. Provide deep segmentation, market share, and trend analysis with commentary to support HI sizing focal activities. Core ownership for sizing data in annual strategic review (SR) planning and quarterly business reviews (QBRs). Ensure documentation of assumptions, methodologies, and data sources for tracking data QoQ (Quarter-over-Quarter) and YoY (Year-over-Year) for trend analysis and executive reporting. Track and analyze BU growth metrics to identify opportunities and risks. Drive automation initiatives to streamline data collection and reporting processes. Collaborate closely with GPM, BM, and Finance to ensure alignment and accuracy of strategic decisions. Research product marketing trends and conduct complex benchmarking analysis of the company's markets, competition, and product mix versus competitors, including insights from earnings calls. Develop complex product forecasts and financial plans, including cost reduction strategies, margin maintenance, and ROI goals. Handle ad hoc requests and deliver under tight deadlines with high accuracy. Demonstrates conceptual and practical expertise in strategic marketing and market analytics. Basic understanding of related disciplines such as technical marketing and product management. Knowledge of industry best practices and competitive differentiation factors. Ability to integrate insights across multiple business units and functions. Acts as a resource for colleagues; Lead small projects with manageable risks and resource requirements. Builds consensus across cross-functional teams. Demonstrates team-first mindset, strong collaboration, and ability to stand behind numbers with confidence. Bachelor's degree in Marketing, Business, Engineering, or related field; MBA preferred. 3-5 years experience in strategic marketing, preferably in semiconductor or advanced packaging. Strong proficiency in Excel, data analytics, and automation tools. Exceptional attention to detail and ability to manage complex datasets. Comfortable working under pressure and meeting tight deadlines. Knowledge of Semiconductor Packaging Heterogeneous Integration, WLP and PLP is a strong plus. Positive attitude and ability to step up to executive-level demands.