Staff Memory Sustaining Physical Design Engineer, HBM

Implement layout changes to resolve issues identified on current HBM designs on silicon and drive towards a timely and efficient tapeout. Interact with teams like DE, PE, PI and TD to understand the challenges due to process limitations and propose layout solutions to alleviate the issues. Be proactive in identifying and flagging design issues, performance problems, and opportunities to improve design performance and reduce power consumption. Responsible for floor plans that optimize circuit placement, signal routing, and power delivery. Deliver block-level (analog or mixed signal) layouts using advanced foundry process node if needed. Contribute to the development of new HBM product opportunities by assisting with the overall planning and optimization of Memory, Logic, and Analog circuits layout. Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products. Mentor new hires as needed. Bachelor's or Master's degree in Electrical Engineering or related field. 8+ years (BS) or 6+ years (MS) of relevant experience. Expertise in Cadence VLE/VXL and Mentor Graphics Calibre DRC/LVS. Strong grasp of analog layout fundamentals including matching, electro-migration, latch-up, coupling, crosstalk, IR-drop, and parasitics. Hands-on experience crafting analog and mixed-signal layouts (e.g., sense amplifiers, LDOs, PLLs). Strong verbal and written communication skills for conveying complex technical concepts. Self-motivated team player who thrives in diverse environments. Proven innovation and problem-solving in high-performance memory development, with experience in DRAM bring-up/debug and advanced packaging (TSV, hybrid bonding, interposers).