The Substrate Technology Integration team is seeking a qualified candidate to fill a Sr. Technology Integration position for next generation EMIB substrate and packaging technology development.
In this role, the candidate will be responsible for the development of integrated process flow, scale up and transfer readiness of critical building blocks needed for next generation packaging technologies.
The candidate will represent Intel Foundry's process readiness in Customer facing meetings.
The candidate will collaborate closely with partners in Substrate Definition, Execution and Supplier Engineering in mapping the development strategy, managing the starts and execution of plans in the factory to meet program milestones.
Likewise, the candidate will work with partners in design and downstream assembly and yield integration teams in developing integrated design rules and specifications for balanced assembly and substrate yields.
Behavioral traits/Skills that we are looking for:
The candidate is expected to have strong problem-solving skills, high tolerance to ambiguity, ability to collaborate well in a fast-paced environment and excellent communication skills.
Demonstrated experience in structured problem solving, high tolerance to ambiguity and achieving strong results in a fast-paced environment
Demonstrated ability to work with large diverse teams with strong collaboration, influencing skills and excellent communication skills to peers and senior management
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
PhD in Electrical or Computer Engineering, Computer Science, Math, Physics, Material Science or STEM related field with 4+ years of related work experience
OR Masters in Electrical or Computer Engineering, Computer Science, Math, Physics, Material Science or STEM related field with 6+ years of related work experience
Specific areas of expertise and experience should include the following:
Experience in substrate, silicon or assembly process development and working experience on typical processes such as patterning/lithography, wet processes, electroless and electrolytic plating, CMP, sputtering/PVD/CVD bumping etc.
Preferred Qualifications:
Previous related work experience in a semiconductor foundry preferred
Experience in Technical Program Management and Technical Problem Solving
Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003
Annual Salary Range for jobs which could be performed in the US:
$136,990.00-264,470.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.