Process Integration Engineer

Act as a module owner to conduct root cause investigations and failure analysis in time-sensitive environments. Drive improvements in yield, cost efficiency, and quality. Run Design of Experiments (DOE) to enhance process capability and margin. Monitor trends and sustain line stability. Address top detractors to improve device yield and reliability. Lead workshops during technology transfer for next-generation devices. Start up, develop, and optimize processes for product quality and reliability. Identify and resolve process-related issues using FMEA, 8D, SPC/FDC methodologies. Coordinate and execute process, equipment, and material evaluations. Validate and qualify new processes, tools, and materials for new product introduction. Manage and audit material suppliers to meet quality, cost, and risk objectives. Support internal and external audits. Be willing to travel internationally for 3+ months for tech transfer/training. Be prepared to work a shifted schedule as required. Bachelor's degree with a minimum 3 years of HVM or FAB experience Minimum 3 years of experience working with Memory Minimum 2 years of experience in semiconductor fabrication areas such as yield ramp, reduction of cost, and quality improvement. Clear understanding of transistor operations, scaling limitations and reliability Master's or Ph.D. degree in Material science, Electrical, Electronics, Chemical or Engineering areas Experience with TD, Process Integration, Device, Yield analysis, QR Strong analytical and problem-solving skills. Effective communication and teamwork. Ability to work in a fast-paced, time-sensitive environment. Respect for diversity and inclusion.