Process Engineer 3

Apply your strong hands-on experience with analytical techniques such as FTIR, XPS, AFM, XRR, XRD, and XRF to increase bandwidth and sustainability of the team activities. Develop and implement analytical metrology solutions, leading to detailed understanding of process induced surface modifications at the atomic level to help resolve process technical challenges in collaboration with Lam technical community. Responsible for developing and implementing in-situ analytical metrology solutions using GP-FTIR, FTIR, MS, OES, and others to: Apply Deep Learning techniques to analyze large amounts of data and spectra in order to identify high-value trends and to extract mechanistic knowledge and root-causes of surface modifications and defect formation. Develop predictive metrology calibrated defectivity models to enable realistic defect simulations in collaboration with process/productivity and simulation teams. Implement and perform SPC methods for periodic evaluation of key metrology assets to ensure that toolsets are operating at optimum performance levels. Bachelor's degree with a minimum of 5 years' of related experience; or a Master's degree with 3 years' experience; or a PhD without experience; or equivalent work experience. Preferred fields: Physics, Materials Science, Chemistry, EE, ChE, CSE, ME or a related field. Highly motivated candidates with strong ability for teamwork/collaboration and customer-centric technology development style are encouraged to apply. Experience in AI techniques (DL, CNN) and Python programming are highly preferred. Familiarity with working in a laboratory and on semiconductor equipment with experience in surface preparation and analytical techniques. In-depth understanding of Statistical Process Control (SPC) and/or Design of Experiments (DOE). Highly proficient in MATLAB, Python, or other similar scientific computing languages. Working knowledge of statistical analysis and problem-solving methodologies. Experience with statistical tools (JMP, Minitab, etc.). Background in Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Plasma Enhanced Chemical Vapor Deposition (PECVD), or Physical Vapor Deposition (PVD). Background in Plasma Physics, Reactive Ion Etching (RIE), Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP), and Capacitively Coupled Plasma (CCP). Knowledge of material synthesis and material characterization. Experience working in a collaborative and matrixed environment with diverse teams, semiconductor customers, and/or partners.