Intern - Product Engineering, HBM

Validate HBM silicon and support debug efforts across die and stack levels. Analyze test data and performance metrics to identify and resolve issues. Collaborate with customer engineering teams to understand requirements and deliver solutions. Assist in preparing technical documentation, presentations, and status updates for customer-facing engagements. Develop, deploy, and use AI/ML models to automate data analysis, anomaly detection, and predictive diagnostics. Participate in cross-functional meetings with Design, Manufacturing, and Quality teams to ensure product alignment with customer needs. Support internal and external communication of product status, risks, and milestones. Strong oral and written communication skills and ability to engage with technical and non-technical stakeholders. Understanding of memory architecture, especially HBM or DRAM. Familiarity with digital circuit concepts and CMOS transistor operation. Experience with Python, C++, or C for data analysis and automation. Exposure to Linux/UNIX environments. Experience or coursework in AI/ML, including model development and deployment. Analytical mindset with a customer-first attitude. Ability to work independently and in a team setting. Minimum junior standing in Electrical Engineering, Computer Engineering, Business or related field.