Etch process engineer

Perform plasma etch (SYM3/ICP etch) process development on a variety of difficult systems. Perform Root Cause Analysis and resolve a variety of difficult process engineering issues. Generate internal and external documentation for products, presentations and technical reports. Interact with internal modules (WET/CMP/Lithograph/Deposition/Integration) to resolve a variety of process engineering issues/problems with limited supervision. Design and implement new technology, products and analytical instrumentation. Utilize techniques to characterize hardware, define methods and apply new technologies to characterize hardware, and/or perform hardware characterization on a wide range of complex systems for multiple products, within safety guidelines Implement new technology, products and analytical instrumentation. Travel may be required. PhD's degree or foreign equivalent in Materials Science, Chemistry, Chemical Engineering, Physical Chemistry, Physics related field and 10 years of experience in job offered or related process engineering position. Plasma etch, including Inductively Coupled Plasma (ICP) and Capacitively Coupled Plasma (CCP) etch tools; Strong understanding of semiconductor manufacturing processes and industry standards including deposition, etch, lithography and metrology Design of experiments (DOE) to resolve complex materials analysis problems Statistical analysis methods and tools Demonstrates depth and/or breadth of expertise in own specialized discipline or field Interprets internal/external business challenges and recommends best practices to improve products, processes or services May lead functional teams or projects with moderate resource requirements, risk, and/or complexity Communicates difficult concepts and negotiates with others to adopt a different point of view