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Engineer I-PCB Layout

Microchip Technology Inc.
Full-time
On-site
Grove, Oklahoma, United States
$68,640 - $128,000 USD yearly

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Visit our careers page to see what exciting opportunities and company perks await!

Job Description:

We are seeking a highly motivated and technically proficient Entry-Level Engineer I-PCB Layout Designer to join our Hardware Engineering team. This role focuses on the critical physical design of Printed Circuit Boards (PCBs), specifically for high-efficiency power supply and power electronics circuits. The ideal candidate will translate complex electrical schematics into manufacturable, high-performance physical layouts, ensuring adherence to rigorous industry standards and power integrity best practices. This is an excellent opportunity for a recent BSEE graduate to apply theoretical knowledge to real-world design engineering solutions.

KEY RESPONSIBILITIES

  • Design and Implementation: Translate detailed electrical schematics, primarily for Switch-Mode Power Supplies (SMPS) and DC-DC converters, into optimized PCB layouts using industry-standard EDA tools.
  • Component Placement Optimization: Execute strategic component placement to minimize parasitic effects (e.g., stray inductance and capacitance), optimize thermal performance, and meet mechanical constraints.
  • Critical Signal Routing: Implement multi-layer routing strategies for high-current and sensitive control signals, ensuring minimal noise, crosstalk, and maintaining controlled impedance where required.
  • Power and Ground Plane Design: Define robust and effective power/ground plane structures to ensure Power Delivery Network (PDN) integrity, minimize ground bounce, and manage electromagnetic compatibility (EMC).
  • Design for Manufacturability (DFM) & Assembly (DFA): Perform rigorous Design Rule Checks (DRC) and collaborate with PCB fabricators and assembly houses to ensure designs are cost-effective and manufacturable at volume.
  • Technical Documentation: Generate comprehensive fabrication and assembly data packages, including Gerbers, drill files, assembly drawings, and Bills of Material (BOMs), ensuring accurate and complete transfer to manufacturing.
  • Cross-Functional Collaboration: Actively work with Electrical, Mechanical, and Signal/Power Integrity Engineers to resolve technical challenges and incorporate design feedback throughout the layout process.
  • Standard Compliance: Ensure all PCB designs strictly comply with relevant industry specifications, including IPC-2221 (Generic Design Standard), IPC-2222 (Rigid PCB Sectional Design Standard), and IPC-6012 (Qualification and Performance Specification for Rigid PCBs), particularly regarding conductor spacing and creepage for power sections.

Requirements/Qualifications:

  • Bachelor of Science in Electrical Engineering (BSEE) from an accredited institution.
  • 0-3 years of Internship/Coursework Experience: Prior relevant experience through internships, co-op programs, or dedicated academic projects focused on PCB design, power electronics, or high-speed/high-current layout is a significant advantage.
  • Tool Proficiency: Demonstrated familiarity or direct experience with professional Electronic Design Automation (EDA) tools, specifically Altium Designer (highly preferred), Cadence Allegro, or Mentor Graphics PADS, for schematic capture and PCB layout.
  • Power Electronics Fundamentals: Solid theoretical and practical understanding of power supply topologies (e.g., Buck, Boost, Flyback) and the critical impact of layout on performance, efficiency, and noise.
  • Industry Standards Knowledge: Foundational knowledge of key IPC standards: IPC-2221, IPC-2222, and IPC-6012. Familiarity with high-current trace width calculation (e.g., using IPC-2152 guidelines) is highly desired.
  • Analytical Skills: Proven ability to analyze design constraints (electrical, thermal, mechanical) and perform hand calculations for fundamental parameters like trace current capacity, impedance, and plane resistance.
  • Technical Communication: Excellent written and verbal communication skills to articulate design decisions, document progress, and clearly convey technical requirements to cross-functional teams and external partners.
  • Design Integrity Concepts: Basic understanding of Signal Integrity (SI) and Power Integrity (PI) principles as they relate to a PCB layout, particularly in minimizing loop areas for high-frequency current paths in power supplies.

U.S. Export Controls Requirements: This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).

Travel Time:

0% - 25%

Physical Attributes:

Feeling, Handling, Hearing, Other, Reaching, Seeing, Talking, Works Alone, Works Around Others

Physical Requirements:

10% Standing, 10% Walking, 80% Sitting, 100% Inside.

Pay Range:

We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading ESPP program with a 2 year look back feature. Find more information about all our benefits at the link below:

Benefits of working at Microchip

The annual base salary range for this position, which could be performed in California, is $68,640 - $128,000.*

*Range is dependent on numerous factors including job location, skills and experience.

Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.

For more information on applicable equal employment regulations, please refer to the Know Your Rights: Workplace Discrimination is Illegal Poster.

To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.

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