Packaging Mechanical Simulation Engineer
Kuala Lumpur, Malaysia
The future starts here! Are you ready to join NXP in Package Innovation?
The Package Innovation organization is responsible for the design of new packaging products and the development of new packaging technologies and assembly processes. It partners with all of the businesses of NXP Semiconductors to deliver the right package for each market and application.
Package Innovation is a multi-national organization. Development in our case means working together in teams with business lines, internal factories and subcontractors and suppliers across the globe.
The Package Innovation Modelling team uses Finite Element Simulation methodologies to shorten development cycles and deliver optimized design solutions for semiconductor packages. Key requirement for virtual prototyping is an efficient and accurate simulation model that does consider multiple physical domains along with complex 3-D structures containing many non-linearities.
To reinforce our modeling and simulation team, we are looking for a mechanical engineer, located in Kuala Lumpur, Malaysia. Your role is to develop simulation models of semiconductor components and assemblies, predict mechanical reliability, help identify technology limits and optimize packaging solutions aiming at a first-time right product qualification.
Your responsibilities
- Be a part of the on-site Package Innovation simulation team at ATKL (NXP Malaysia) and collaboratively solve engineering questions for package development projects.
- Collaborate with Assembly Process Innovation and Manufacturing teams to develop meaningful models for manufacturing processes.
- Support problem-solving of package related issues during lifetime testing.
- The engineer will be expected to drive package design with modelling insights and to support new concepts development.
Your team
The modelling team’s responsibility is to support new product and technology developments with thermal and mechanical modelling. When unexpected results are found during testing the simulation team helps with root cause finding and deriving potential solutions. The team has a global presence but also has several other members on site in ATKL. The team reports into the Package Core Technologies department within Package innovation and will interface with several other internal departments, including all the business lines.
Your profile
To be successful in this role you have:
- A degree qualified in Mechanical Engineering or equivalent is required
- Experience with Finite Element Modelling
- Fluent in English
- Understanding of semiconductor packaging technologies is preferred.
Furthermore, you are:
- An excellent communicator, teamplayer, influencer and networker.
- A self-starter with initiative, flexibility and command skills.
More information about NXP in Malaysia...