Job Summary:
·New Package Technology and New Platform Module Development
oResponsible for new package/technology development following Advanced Product Qualification Plan (APQP).
oGood understanding of MRS and generate PRS with SCD definition.
oResponsible for internal/external package structure with designer, materials, assembly process flow and cost structure to meet the development goal.
oFamiliar with DFM, to secure robust manufacturability with quality requirements.
oGood understanding of power module package design rule, design rule update with new platform development.
oGenerate deliverables upon package development procedure (DFMEA, control plan, process FMEA, LAR plan, QFD, etc.).
oPlanning and execution for development activities per development phase with process development engineers (feasibility, process characterization, LAR, etc.).
oDrive problem solving methodology with risk assessment to find technical issue and provide systematic solution.
oStrong knowledge and in-depth understanding of device-package interaction.
oEffectively working with team for on time development.
·Technical Project Management and Communication
oResponsible for defining and ensuring adherence based on technical requirement, quality requirement, project timing and cost.
oStrong communication with team for technical issue and problem solving, provide the improvement timeline with RCCA definition.
oSupporting to track and remind team members for tasks, deliverables, milestones of projects, successfully work with PM to be developed on time.
oParticipate in all project/gate review, alignment with team.