Packaging Materials Engineer
Kuala Lumpur, Malaysia
The future starts here! Ready to join NXP in the Package Innovation department
The Package Innovation organization is responsible for the design of new packaging products and the development of new packaging technologies and assembly processes. It partners with all of the businesses of NXP Semiconductors to deliver the right package for each market and application.
Package Innovation is a multi-national organization. Development in our case means working together in teams with business lines, internal factories and subcontractors and suppliers across the globe.
As Packaging Materials Engineer your challenge will be to co-develop material technologies and characterize packaging materials in order to understand relationships between packaging materials and product reliability. With your knowledge and experience you will provide Best-in-Class Technology in all aspects – Quality, Performance, Integration and Cost of Ownership, while cooperating with the material suppliers, Package Innovation colleagues, Business Lines, assembly sites and customers on a global scale.
Your responsibilities
- Be the on-site materials engineer at ATKL (NXP Malaysia) for New Product Integration and New Technology integration
- Collaborate with Assembly Process Innovation and Manufacturing teams to develop and integrate new materials into packages at ATKL (die attach, molding compounds, leadframes)
- Support problem-solving of material-related issues at ATKL
- The engineer will be expected to drive advanced package material selection to meet NXP's total product package performance requirements across the product applications.
Your team
The Material team’s responsibility is to source, analyze, co-develop and integrate new materials into the die package system to achieve optimum product manufacturability, quality and reliability. The team will report into the Package Core Technologies department within Package innovation and will interface with several other internal departments, including the business lines.
Your profile
To be successful in this role you have:
- A degree qualified in Materials Science, Mechanical Engineering or Chemical engineering
- Experience in microelectronics packaging materials
- Statistical analysis skills would be an asset
Furthermore, you are:
- An excellent communicator, influencer and networker.
- A self-starter with initiative, flexibility and command skills.
More information about NXP in Malaysia...