The Design Methodologies and Tools Engineer / Architect develops and applies Computer Aided Design (CAD) software engineering methods, theories and research techniques in the investigation and solution of technical problems. Assesses architecture and hardware limitations, plans technical projects in the design and development of CAD software. Defines and selects new approaches and implementation of CAD software engineering applications and design specifications and parameters. Develops routines and utility programs. Prepares design specifications, analysis and recommendations for presentation and approval. May specify materials, equipment and supplies required for completion of projects and may evaluate vendor capabilities to provide required products or services.
Position Description:
NXP Semiconductors is looking for an IC Packaging/Co-Design CAD Application Engineer, providing best in class support for the Packaging, Co-Design and Board design environment. This individual will support both local and regional Package and Board designers, in the development of SOC products, across multiple products. Coordinating with other IC CAD support, internal flow developments and development teams to deliver new and improved flows, tools and improving design teams productivity. The candidate would be located in the NXP Austin Texas location.
Duties and responsibilities
- Support, enhance and maintain design infrastructure for the IC Package and Board design teams
- Coordinate with the Flow Development team, validating and deploying new tools and flows
- Coordinate with the Flow Development team to unify the entire design fabrics (IC, Package, and PCB) into a common design environment with well-known EDA tools.
- Coordinate with internal development teams and EDA vendors, on training, tracking and resolution of issues
- Develop software utilities to aide in automation of the design environment
- Create technical documentation on procedures and flows
- Work within a regional and global CAD organization
- Work with multidisciplinary teams
Requirements and Skills
- BS/MS in Electrical Engineering or Computer Science, with 3+ years’ experience
- Require knowledge of the Analog – RF IC, IC package, PCB design process
- Industrial experience in Analog and RF domain (die, package and PCB) is recommended, specifically Cadence Allegro for package and PCB designs is highly recommended
- Knowledge of Cadence (Allegro, Virtuoso RF), Ansys-HFSS, ADS-RFPro is a bonus.
- Knowledge of Electromagnetic 2.5 / 3D simulations, specifically with available commercial tools is plus.
- Knowledge of Cadence Virtuoso for IC design flow
- Several years of working experience in the IC and package design flow
- Demonstrates good analysis and problem-solving skills
- Rigorous in meeting performance and quality standards
- Must have effective interpersonal, teamwork, and communication skills
- Proficient in communicating and writing technical documentation in English
- Must have the ability to multi-task in a fast pace environment
- Collaborative skills for working efficiently in a team having worldwide connections with partners and users
- Self-driven and passionate about learning and the industry
- Knowledge of software programming: Python, PERL, Cadence SKILL, other based applications in a Unix/Linux environment
More information about NXP in the United States...
NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.