Foveros Advanced Packaging Engineering Manager

Albuquerque, New Mexico, United States Job ID JR0255065 Job Category Manufacturing and Process Development Work Mode Hybrid Experience Level Experienced

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Job Description

The New Mexico Disaggregated Manufacturing Organization (NM DMO) is growing rapidly as it brings the Foveros HVM (High Volume Manufacturing) to life under a single organization with all segments of the process co-located at a single campus for the first time. As part of this exciting growth opportunity, the Fab 9 Foveros organization is seeking Advanced Packaging Engineering Module Group Leaders to join our team as key contributors to our startup and ramp into HVM for Sort/Test, Die Prep, and Wafer Level Assembly areas.

As a Fab 9 Engineering Module Group Leader you will manage a group of Process Engineers, partnering with the transfer site and will be responsible for the successful startup and ramp for a module within Fab 9. You will be responsible for daily tactical execution and strategic direction, setting priorities for the team, driving results across boundaries, developing employees, and managing performance. You will be responsible for ensuring a safe, inclusive work environment while meeting your area/factory commitments.

Responsibilities will include but are not limited to:

Partnering with Manufacturing/Production/Integration and other Engineering teams to execute a successful and on-time factory ramp
Participating in building out the engineering teams to support production ramp
Managing and leading the technical engineering team to meet all safety, quality, output, cost, and people performance requirements
Understanding and driving solutions to technical issues impacting equipment ramp and manufacturing output
Providing technical and tactical direction, driving methodical sustaining, systematic troubleshooting, and continuous process improvement
Developing skills and expertise of your team, enabling long term growth and development
Driving effective meetings and decision-making forums ranging from working level to technical task forces
Using your creativity, education, industry experience to guide your team to resolving leading edge technological challenges
Identifying areas of waste and prioritizing appropriately to eliminate
Working closely with other Module Engineering teams to solve integrated process and equipment problems
Working with other global partner sites to share learnings, maintain Copy Exactly, and drive improvements
Partnering with the Manufacturing Team (Operations Managers/Shift GLs) and the Production Team (Manufacturing Engineers and Industrial Engineers) to run the factory, develop technician workforce, and ensure availability and utilization goals are met
Leading the execution of key programs and deliverables on behalf of the area and the factory

The ideal candidate should also exhibit the following behavioral traits:

A passion and commitment for growing and developing people
Results-oriented, organized, assertive, resourceful, and independent
Capable of distilling complex information into clear messages and communicating both upward and downward in the organization
Willingness to receive and give multiple inputs/directions and prioritize according to factory and organizational needs
Attention to quality and detail
Role modeling Intel's cultural attributes: Inclusion, Customer Obsession, One Intel, Truth and Transparency, Quality, and Fearlessness

Relocation assistance provided.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Candidate must have a Bachelor's, Master's, or PhD degree in Mechanical, Electrical, Chemical Engineering, Materials Science, Physics, or a related technical field of study.
4+ years of experience as an Engineer in a wafer fabrication environment with demonstrated formal leadership.

Preferred qualifications:

5+ years experience with semiconductor equipment and processes
2+ years experience managing people
Experience in advanced packaging- Dicing, Thinning, Bonding, Mold, Die Sort experience desired

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

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Maggie Offensive Security Researcher

“I’ve always wanted to do something that changes the world — at Intel, I feel appreciated, and I’ve gained more confidence in myself. It makes me feel like I’m capable of doing great things.”