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Principal Marketing Manager, Multi-Die

pin iconSunnyvale, California United States Apply Now
Category: Product Management Hire Type: Employee
Job ID 48633BR Salary Range $179,000 - $269,000 Date posted 02/22/2024
Multi-Die Marketing Manager

Synopsys is a leading IP provider and key partner to our customers and the semiconductor industry as they build the products that are influencing our everyday lives. As our industry and business continues to grow, technology changes continue to shape the way we build products to support our customer’s SoCs and the semiconductor foundries that fabricate the designs. We are seeking an outstanding Multi-Die Marketing Manager who will be focused on a deep knowledge of multi-die design & development, substrates, packaging and our foundry partners offerings. Within Synopsys, the empowered candidate will be our in-house multi-die industry expert and driving our strategy while providing information for management, Product Managers, R&D and sales enabling us to deliver the best products optimized across multiple market segments.

Responsibilities:
  • Your primary responsibility will be to develop the technology roadmap and strategy for 3DIC and 2.5D/3D heterogenous integration for multi-die products including: chiplets, substrates, multi-chip packaging and power delivery networks.
  • Engage with customers and stakeholders to comprehend their needs, collect feedback, identify opportunities, and contribute to the development of our offerings. Participate in industry conferences to understand domain challenges and emerging trends
  • Establish and cultivate relationships with industry influencers, partners, and thought leaders to promote our products and build a robust network
  • Conduct comprehensive market research and competitor analysis to stay abreast of industry trends and pinpoint areas of differentiation
  • Collaborate closely with cross-functional teams to define and coordinate Synopsys IP strategic directions with other Synopsys division to develop a full 3DIC solution
  • Be able to create presentations and articulate Synopsys 3DIC position and strategy to internal and external customers
  • Coordinate and position with the foundry for our 2.5D and 3D chiplets and multi-die test chips



Requirements:
  • Experience in the semiconductor industry, ideally at a semiconductor foundry, OSAT or semiconductor manufacturer developing heterogenous multi-die solutions. Beneficial if you have existing relationships with foundry or OSAT business development teams
  • Experience in multi-chip packages, SiPs (System in Package) and modules
  • Experience in recent Power Delivery Network (PDN) trends including backside PDN
  • Experience with split die, 2.5D and 3D packaging designs/process and applications
  • At least eight years marketing or business development experience and five years of cross functional management experience
  • Exceptional business acumen and sufficient knowledge of the market segments, applications and technology to drive IP strategies
  • Able to simultaneously contribute to strategy development, drive cross-functional teams, and execute with excellence
  • Possesses excellent command and communication skills; able to create and deliver presentations to customers, management, foundry partners, product managers, R&D and Sales
  • Organizationally savvy and able to work in a matrixed, team orientated environment with multiple stakeholders
  • Must be able to define and drive a successful program ‘by influence’ to drive customer and product requirements collaboratively within the business unit
  • Bachelor’s degree in Engineering is required; a graduate degree in engineering or business is desired
  • Must be able to use Microsoft Excel, Pivot tables and PowerPoint
  • Position will be based in Silicon Valley, CA

The base salary range across the U.S. for this role is between $179,000-$269,000. In addition, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request.

At Synopsys, we’re at the heart of the innovations that change the way we work and play. Self-driving cars. Artificial Intelligence. The cloud. 5G. The Internet of Things. These breakthroughs are ushering in the Era of Smart Everything. And we’re powering it all with the world’s most advanced technologies for chip design and software security. If you share our passion for innovation, we want to meet you.

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Inclusion and Diversity are important to us. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, military veteran status, or disability.

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Synopsys Hiring Process 1. Apply. As an applicant, your resume, skills, and experience are being reviewed for consideration. 2. Phone screen. Once your resume has been selected, a recruiter and/or hiring manager will reach out to learn more about you and share more about the role. 3. Interview. You will be invited to meet with the hiring team to measure your qualifications for the role. Our interviews are held either in person or via zoom. 4. Offer. Congratulations! You have been selected as a finalist; your recruiter will reach out to propose your offer details. A written offer will soon follow. 5. Onboarding. You will be invited to complete new hire documents to ensure you are set-up and prepared for your first day. 6. Welcome. Your hiring manager, team, and an assigned buddy will help you get acclimated. Over the next few weeks, you will receive communications and engagement invitations that will help ramp you up for your future at synopsys

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