Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale helps our customers – who make smartphones, supercomputers, virtual reality headsets, autonomous vehicles and more – transform their ideas into reality. Our innovations Make Possible® a Better Future.
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If you’re looking for a great place to grow your career, consider Applied Materials. With the data explosion and new investment in semiconductors, it’s an exciting place to be.
Applied Materials’ Advanced Packaging Department is searching for an intern to join our team in early 2024! Advanced packaging technology is critical to continue enabling Moore’s law through heterogenous integration of chiplets. Chiplets are integrated on the package thanks to novel wafer level processes such as hybrid bonding. New materials selection and integration within the hybrid bonding process flow are key to scale the next generation of interconnects. This internship will be focused on selecting, modelling, and integrating new materials for hybrid bonding technology. Understanding of materials behaviors and interaction will be a key component of the project, as well as modelling tools. The position will entail the following:
$42 - 46 per hour
The salary offered to a selected candidate will be based on a number of factors including location and education level and will vary depending on confirmed job-related knowledge, skills, and experience
Years of Experience:
Time Type:Full time
Employee Type:Intern / Student
Travel:Yes, 10% of the Time
Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.