We are redefining what’s possible in semiconductor interconnects and packaging. Our groundbreaking technology platform, Passage, is built to break barriers, eliminating traditional constraints like silicon area per package scaling and reimagining interconnect density. With our advanced photonic chips and high-performance lasers, we’re enabling the next generation of computing, from single reticle solutions to wafer-scale integration.

We don’t just follow the roadmap, we create it. Our innovations in 3D-stacked photonics push networking radices to new heights, paving the way for the computing power needed to achieve artificial general intelligence (AGI). The future of high-performance computing is being built today, and we’re delivering the photonic technology that will make it possible.