U.S. Tech Scale-Up


Apple is making a major push to expand domestic chip production, committing $600 billion to boost U.S. manufacturing and supply chains. This includes investments in advanced packaging, rare earth materials, and partnerships with key suppliers. GlobalFoundries is also stepping up with a $16 billion investment to scale chip manufacturing and R&D in New York and Vermont, backed by Apple and other tech giants. These moves aim to strengthen the U.S. position in semiconductor design, fabrication, and packaging amid rising demand and global competition.

Meanwhile, Inprentus has joined the National Semiconductor Technology Center (NSTC) as a core member, bringing its nano precision lithography capabilities into the national R&D effort. Littelfuse appointed Dr. Karim Hamed to lead its semiconductor division, signaling a renewed focus on growth and innovation. The landscape is shifting fast, with engineers across design, fab, and packaging seeing more opportunities as U.S. based manufacturing ramps up.

Littelfuse Appoints Dr. Karim Hamed as SVP & GM, Semiconductor Business

Littelfuse has appointed Dr. Karim Hamed as Senior Vice President and General Manager of its Semiconductor Business, marking a leadership shift in its semiconductor division.

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Inprentus Joins the National Semiconductor Technology Center as a Core Member

Inprentus, a leading manufacturer of advanced precision optics using nano-scale lithography, has joined the U.S. National Semiconductor Technology Center (NSTC) as a core member, solidifying its role in catalyzing semiconductor R&D and innovation.

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Apple Expands U.S. Investments to $600 Billion with New Manufacturing Initiative

Apple has increased its total U.S. investment to $600 billion and unveiled its "American Manufacturing Program" to support expansion across multiple states, boost supplier networks, and reinforce domestic production.

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GlobalFoundries Deepens Partnership with Apple to Strengthen U.S. Chip Manufacturing

GlobalFoundries has expanded its collaboration with Apple to enhance wireless connectivity and power management technologies, further bolstering U.S. semiconductor manufacturing.

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