
The semiconductor industry is facing mounting supply chain and environmental pressures. PwC has flagged a potential copper shortage that could disrupt chip production, while new research shows that climate change now threatens over one-third of global manufacturing capacity. These risks are especially critical for fabs in East Asia and the southwestern U.S., raising concerns about long-term operational stability.
Despite these challenges, the market is showing strong signs of recovery. TSMC has overtaken Samsung in total output, marking a major shift in the foundry landscape. Global chip sales rose 27% year over year in May, driven by demand in AI, automotive, and data centers. Forecasts also point to the semiconductor equipment market surpassing $140 billion by 2032, underscoring continued investment in advanced manufacturing.
PwC warns that a looming global copper shortage could disrupt semiconductor production, which relies heavily on copper for interconnects and packaging. As demand outpaces supply, chipmakers may face production delays and increased costs.
A new study highlights that over 30% of the world's semiconductor manufacturing capacity is at risk due to extreme weather and rising temperatures. Key hubs in East Asia and the southwestern U.S. are particularly vulnerable.
TSMC has officially surpassed Samsung in semiconductor manufacturing volume and market leadership, solidifying its position as the industry's dominant foundry. The milestone reflects TSMC’s consistent investment in advanced nodes and capacity.
Following years of decline, chip sales are rebounding across multiple sectors. Demand is being fueled by AI applications, automotive electronics, and data center expansion.
The Semiconductor Industry Association (SIA) reports a 27% year-over-year growth in global chip sales for May 2025, signaling a strong rebound and growing market momentum.
According to new market research, the global market for semiconductor manufacturing equipment is expected to exceed $140 billion by 2032, driven by increasing fab investments and demand for advanced packaging technologies.