
This week’s semiconductor news highlights key shifts in global strategy, cybersecurity, and industry leadership. TSMC is pushing ahead with construction at its Arizona sites, reinforcing the U.S. as a major hub for advanced chip manufacturing. Meanwhile, Huawei and Xiaomi’s rapid in house development is helping China close the technology gap, drawing attention from U.S. officials. At the same time, geopolitical tensions are impacting the flow of critical AI hardware, with the UAE’s Nvidia chip deal now reportedly on hold due to U.S. scrutiny.
On the industry leadership and security front, Credo CEO Bill Brennan has joined the Global Semiconductor Alliance board, reflecting continued alignment between business and global collaboration. Proofpoint warns that cyber threats to chip companies are on the rise, targeting R&D and IP. Looking ahead, analysts expect a dramatic shift in the foundry landscape by 2030, driven by regional expansion and changing customer needs.
Cybersecurity firm Proofpoint highlights the increasing targeting of semiconductor companies by sophisticated threat actors, warning that phishing, espionage, and ransomware attacks are growing more frequent and advanced.
Bill Brennan, CEO of Credo Technology, has been appointed to the Global Semiconductor Alliance Board of Directors, strengthening Credo’s position in the global industry and advancing collaboration across the semiconductor ecosystem.
Taiwanese chipmaker TSMC is accelerating construction efforts at its Arizona plants, aiming to reinforce its global production capabilities and meet rising U.S. demand for advanced semiconductors.
New analysis credits Huawei and Xiaomi as key forces behind China’s fast semiconductor advancements, leveraging state support, in-house development, and domestic innovation to close the tech gap.
The UAE’s high-profile deal to acquire Nvidia AI chips has reportedly stalled due to U.S. government concerns over geopolitical risks, raising questions about future international chip sales and regulations.
By 2030, global foundry dynamics are set to evolve with increased regionalization, new players, and changing customer needs reshaping the manufacturing environment for advanced chips.