Scott Varga, Sr. Analyst, Digital Marketing at Amkor did a roundup of these posts.
Original Posting below:
The 2022 Year in Review - Amkor Blogs 🔥
2022 was a great year of having our IC packaging, test and design engineers write blogs on Semiconductor Engineering. They included topics such as #3D sensing technologies, materials for #automotive ICs, #semiconductor testing, #thermal characterization, IC package illustrations, and package development to #quality and #reliability solutions.
▶ Thin Quad Die Package (QDP) Development – https://lnkd.in/egqf9CZu
▶ Thermal Management Implications For Heterogeneous Integrated Packaging – https://lnkd.in/gaEtK4u6
▶ Wirebond IC Substrates: Challenges Ahead – https://lnkd.in/gdXGrPVa
▶ Challenges For Achieving Automotive Grade 1/0 Reliability In FCBGA and fcCSP Packages – https://lnkd.in/gXa8Am-j
▶ The Drive Toward Zero Defects – https://lnkd.in/gZDBeBKk
▶ Packaging Solutions For Unique Markets - https://lnkd.in/ge_cKKuz
▶ IC Package Illustrations, From 2D To 3D – https://lnkd.in/dmdDQ7nZ
▶ Heterogeneous IC Packaging: Optimizing Performance And Cost – https://lnkd.in/gCGykUw7
▶ Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO – https://lnkd.in/dtpJn-Mr
▶ Production Testing Of Discrete Power Products – https://lnkd.in/gr-kQZEp
▶ The Rise Of Copper Wires In Automotive ICs – https://lnkd.in/dpEjz46D
▶ 3D Sensing Package Solutions – https://lnkd.in/gKbnrJrk