Amkor

Many blog posts written by amkor employees during 2022. These blog posts appear on Semiconductor Engineering.


Scott Varga, Sr. Analyst, Digital Marketing at Amkor did a roundup of these posts.

Original Posting below:

The 2022 Year in Review - Amkor Blogs 🔥


2022 was a great year of having our IC packaging, test and design engineers write blogs on Semiconductor Engineering. They included topics such as #3D sensing technologies, materials for #automotive ICs, #semiconductor testing, #thermal characterization, IC package illustrations, and package development to #quality and #reliability solutions.


Amkor Technology, Inc. invites you to take some time and read these informative #blog posts below and share them with your network.


â–¶ Thin Quad Die Package (QDP) Development – https://lnkd.in/egqf9CZu

â–¶ Thermal Management Implications For Heterogeneous Integrated Packaging – https://lnkd.in/gaEtK4u6

â–¶ Wirebond IC Substrates: Challenges Ahead – https://lnkd.in/gdXGrPVa

â–¶ Challenges For Achieving Automotive Grade 1/0 Reliability In FCBGA and fcCSP Packages – https://lnkd.in/gXa8Am-j

â–¶ The Drive Toward Zero Defects – https://lnkd.in/gZDBeBKk

â–¶ Packaging Solutions For Unique Markets - https://lnkd.in/ge_cKKuz

â–¶ IC Package Illustrations, From 2D To 3D – https://lnkd.in/dmdDQ7nZ

â–¶ Heterogeneous IC Packaging: Optimizing Performance And Cost – https://lnkd.in/gCGykUw7

â–¶ Thermal Simulation Of DSMBGA And Coupled Thermal-Mechanical Simulation Of Large Body HDFO – https://lnkd.in/dtpJn-Mr

â–¶ Production Testing Of Discrete Power Products – https://lnkd.in/gr-kQZEp

â–¶ The Rise Of Copper Wires In Automotive ICs – https://lnkd.in/dpEjz46D

â–¶ 3D Sensing Package Solutions – https://lnkd.in/gKbnrJrk